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Probably The Best ALD news blog. Covering new and old developments in Atomic Layer Deposition and Technology. From BALD Engineering:

jonas.sundqvist@baldengineering.com

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PICS - A EU project to develop innovative Atomic Layer Deposition materials and tools for high density 3D integrated capacitors

CapacitorPosted by Jonas 2014-01-19 13:24:45

PICS - A EU project to develop innovative Atomic Layer Deposition materials and tools for high density 3D integrated capacitors

GRENOBLE and CAEN, France – Oct. 23, 2013 –CEA-Leti, Fraunhofer CNT and three European SMEs, IPDiA, Picosun and SENTECH Instruments, have launched a project to industrialize 3D integrated capacitors with world-record density.

Thetwo-year EU-funded PICS project is designed to develop a disruptive technology that results in a new worldrecord for integrated capacitor densities (over 500nF/mm2) combined with higher breakdown voltages. It will strengthen the SME partners’ position in several markets, such as automotive, medical and lighting, by offering an even higher integration level and more miniaturization.

The fast development of applications based on smart and miniaturized sensors in aerospace, medical, lighting and automotive domains has increasingly linked requirements of electronic modules to higher integration levels and miniaturization (to increase the functionality combination and complexity within a single package). At the same time, reliability and robustness are required to ensure long operation and placement of the sensors as close as possible to the “hottest” areas for efficient monitoring. For these applications, passive components are no longer commodities. Capacitors are indeed key components in electronic modules, and high-capacitance density is required to optimize – among other performance requirements – power-supply and high decoupling capabilities. Dramatically improved capacitance density also is required because of package shrink.

IPDiA has for many years developed an integrated capacitors technology thatout performs current technologies (e.g. tantalum capacitors) in terms of stability in temperature, voltage, aging and reliability. Now, a technological solution is needed to achieve higher capacitance densities, reduce power consumption and improve reliability. The key enabling technology chosen to bridge this technological gap is atomic layer deposition (ALD) that allows an impressive quality of dielectric.


Picture 1: Prototype of medical pills integrating temperature sensor and RF transceiver
Picture 2: 3D trench capacitors integrated into Silicon

The PICS project consortium will address all related technological challenges and setup a cost-effective industrial solution. Picosun will develop ALD tools adapted to IPDiA’s 3D trench capacitors. SENTECH Instruments will provide a new solution to more accurately etch high-K dielectric materials. CEA-Leti and Fraunhofer CNT will help the SMEs to create innovative technological solutions in order to improve their competitiveness and gain market share. Finally, IPDiA will manage the industrialization of these processes.

http://www.fp7-pics.eu

Dresden, Germany and Espoo, Finland, October 25, 2013 – Picosun Oy, the leading Atomic Layer Deposition (ALD)equipment manufacturer, provides novel batch ALD processes for fast, cost-efficient mass production of next generation 3D capacitors.

High power density 3D capacitor technology, which is suitable for storing and handling largequantities of energy, is utilized for example in pacemakers and other implantable medical devices, electric cars, and more and more efficient memories for computers and mobile devices. To realize these applications, power consumption, long-term stability, and general reliability of the capacitors and other related electronic components need improvement and their footprint substantial reduction.

Advanced, innovative ALD structures are in a central role when addressing these challenges and Picosun, as the leading supplier of mature batch ALD technology, is a natural choice for providing both ALD tools and processes for the capacitor manufacturing. With its demonstrated, optimized and production-proven ALD processes, Picosun is solidifying its position as the technological leader in the future 3D capacitor market.

“Picosun is the only company offering mature ALD batch equipment that can run stand alone or be clustered using a vacuum robot enabling a production ramp in a cost-efficient way. We aim at transferring our proven high-k capacitor material and process knowledge to an ALD batch system from Picosun and thereby improving cost-of-ownership for applications employing thicker high-k for high voltage applications. Such an offering is not available at the market today,” comments Dr. Jonas Sundqvist, group leader of high-k devices at Fraunhofer CNT, Germany. Fraunhofer CNT, a top European research center for micro- and nanoelectronics is one of Picosun’s collaboration partners in the EU 7th Framework Program project PICS (“Development of innovative ALD materials and tools for high density 3D integrated capacitors”, http://www.fp7-pics.eu/), a part of which the work for the next generation 3D capacitor production upscaling is.

Picosun’s world leading ALD technology enables industrial leap into the future by novel, cuttingedge coating solutions, with four decades of pioneering, groundbreaking expertise in the field. Today, PICOSUN™ ALD systems are in daily production use in numerous prominent industries around the globe. Picosun is based in Finland, it has its subsidiaries in USA and Singapore, and world-wide sales and support network.

http://www.picosun.com/









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