BALD Engineering News Blog

BALD Engineering News Blog

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Probably The Best ALD news blog. Covering new and old developments in Atomic Layer Deposition and Technology. From BALD Engineering:

LAM Research sees a transition to single wafer atomic layer deposition (ALD) tools for multi-patterning as the film conformality and uniformity requirements increase

ALD EquipmentPosted by Jonas 2014-01-30 12:58:23

As reported by Seeking Alpha - Lam Research Management Discusses Q2 2014 Results - Earnings Call Transcript :

“In DRAM, the number of multi-patterning steps more than doubles with the transition to 20-nanometer going from 3 or 4 in a mid-2x device to between 8 and 10 at 20-nanometer, with the same evidence of upsize on number of passes. You should expect more specificity from Lam on this in the coming quarters. This transition also presents growth opportunities for our deposition business. Many of the spacer-based, multi-patterning deposition steps can be done with batch variances today. However, customers are evaluating or starting to transition these steps to single wafer atomic layer deposition, or ALD tools, as the film conformality and uniformity requirements increased.”

Access the full transcript thru Seeking Alpha

Jan. 29, 2014 9:50 PM ET

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